Schneider Electric TSXP57303AM Double-Format PL7 Processor

Description

The Schneider Electric TSXP57303AM is a double-format Modicon Premium processor engineered for demanding automation workloads. It delivers consistent control performance across multi-rack architectures and supports large distributed I/O systems without compromising scan time. In addition, its PL7 Junior/Pro software compatibility allows engineers to reuse existing logic while extending system capability. The processor maintains stable operation in industrial environments and provides flexible communication expansion for complex field integration.

Key Features

The TSXP57303AM offers strong execution performance that benefits process, discrete, and hybrid automation tasks. Moreover, its combination of high I/O capacity, structured task scheduling, and broad communication module support enables scalable architectures. Engineers can deploy fast application cycles using master, event, and fast tasks, which helps optimize response times in mixed-signal systems. Therefore, the module serves both modernization projects and long-life installations requiring predictable CPU behavior.

Technical Specifications

General

• Manufacturer: Schneider Electric

• Product Line: Modicon Premium

• Part Number: TSXP57303AM

• Product Type: Double-format PL7 processor

• Weight: 0.52 kg

• Protection: IP20

• Pollution Degree: 2

Rack & I/O Capacity

• Number of Racks: 16 (4/6/8-slot racks), 8 (12-slot racks)

• Number of Slots: 128, 96, or 64

• Discrete I/O Capacity: 1024 I/O

• Analog I/O Capacity: 128 I/O

• Application-Specific Channels: 32

• Process Control Channels: 15 (up to 45 simple loops)

Memory

• Internal RAM (without PCMCIA): 64 Kwords program & data

• Internal RAM (with PCMCIA): 80 Kwords data

• PCMCIA Card: 384 Kwords program, 2688 Kwords additional data

Performance

• Execution Time per Instruction:

• Boolean: 0.12 µs (without card), 0.17 µs (with card)

• Word/Fixed-Point: 0.17 µs (without card), 0.33 µs (with card)

• Floating-Point: 2.5 µs (without card), 2.6 µs (with card)

• System Overhead: 0.29 ms fast task, 1.15 ms master task

• Application Structure: 1 master task, 64 event tasks, 1 fast task

Communication

• Integrated Ports: Non-isolated serial link, 2× mini-DIN (19.2/115 kbit/s)

• Supported Modules: 2 fieldbus modules (1 if CANopen used), 8 AS-i modules, 1 CANopen, 3 network modules

Environmental

• Operating Temperature: 0…60 °C

• Storage Temperature: −25…70 °C

• Relative Humidity: 10–95% (operation), 5–95% (storage)

• Operating Altitude: 0–2000 m

• Certifications: CE, UL 508, CSA, DNV, GL, BV, LR, RMRS, RINA

Typical Applications

The TSXP57303AM is commonly used in mid- to large-scale automation platforms that demand stable cycle times and multi-rack expansion. For instance, OEM machinery, materials-handling systems, batch processing units, and infrastructure controls benefit from its deterministic execution model. Moreover, its multi-network capability simplifies integration with legacy Modicon assets and third-party fieldbus devices.

Support & Maintenance

Schneider Electric discontinued this model on 23 January 2021, with service support available until 31 December 2026. Therefore, users planning long-term maintenance strategies should consider the recommended replacement BMEP583020 from the Modicon M580 line. The newer platform provides stronger cybersecurity and enhanced processing power while maintaining migration pathways.

FAQ

Q1: Is the TSXP57303AM still available for new installations?
No. It has been discontinued, but service support continues until the announced end-of-service date.

Q2: What is the recommended replacement CPU?
The suggested alternative is the Schneider Electric BMEP583020 processor module.

Q3: Can existing PL7 applications run on this processor?
Yes. The TSXP57303AM is designed for PL7 Junior/Pro environments and supports legacy logic structures.

Q4: Does the module support fast control loops?
Yes. It includes 1 fast task and 64 event tasks, allowing rapid responses in time-critical processes.

Q5: What communication options are available?
The processor supports serial links and modular communication options, including fieldbus, AS-Interface, CANopen, and network modules.